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Documentation, not marketing claims

Data sheets are published here as each product's manufacturer documentation is finalized. Nothing is posted before it can be verified.

Specification fundamentals

Surface preparation

Mechanical preparation to an ICRI CSP profile appropriate to the system thickness. Grinding, shot blasting and scarifying are selected by coating type and existing contamination.

Moisture testing

Relative humidity probe testing per ASTM F2170 and calcium chloride testing per ASTM F1869 inform whether a mitigation primer is required.

Environmental conditions

Substrate temperature must stay above dew point during application and cure. Product-specific temperature and humidity windows are published on each data sheet.

Maintenance

Routine dust mopping and neutral-pH cleaning preserves gloss. Aggressive solvents and steel wheels shorten the service life of any resinous surface.

TDS and SDS by product

ProductCategoryTDSSDS
Legends Epoxy PrimerPrimers and Moisture BarriersPendingPending
Legends Moisture BarrierPrimers and Moisture BarriersPendingPending
Legends Epoxy Build CoatEpoxy Base CoatsPendingPending
Legends Clear EpoxyEpoxy Base CoatsPendingPending
Legends Metallic PigmentMetallic PigmentsPendingPending
Legends Decorative FlakeDecorative FlakesPendingPending
Legends Polyaspartic ClearPolyaspartic TopcoatsPendingPending
Legends Polyaspartic PigmentedPolyaspartic TopcoatsPendingPending
Legends Urethane-Cement MortarUrethane ProductsPendingPending
Legends Urethane Seal CoatUrethane ProductsPendingPending
Legends Grip AdditiveSlip-Resistant AdditivesPendingPending
Legends Crack and Joint RepairConcrete Repair MaterialsPendingPending
Legends Spike ShoesApplication ToolsPendingPending
Legends Notched SqueegeeApplication ToolsPendingPending
Legends Garage Flake KitComplete Flooring KitsPendingPending
Legends Metallic KitComplete Flooring KitsPendingPending

Need a submittal package?

Specifiers and general contractors can request system build-up documentation, product data and project references for bid packages.

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